This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon,polycrystalline silicon grinding and bevelling.
Standard size：200*62*80*5*7 and 200*62*80*15*10
Grit：100#—1000#
Following is the specification of this type of grinding wheels:
Silicon wafer grinding wheel size chart |
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| Diameter | Thickness | Hole | Rim Width | Rim Thickness |
| 200 | 35 | 76 | 3,5,6,9 | 3~8 |
| 200 | 50 | 80 | 3,5,6,9 | 3~8 |
| 200 | 60 | 80 | 3,5,6,9 | 3~8 |
| 220 | 65 | 180 | 3,5,6,9 | 3~8 |
| 300~350 | 20~40 | 127 | 5,7 | 3~8 |
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