Resin bond diamond grinding wheel for silicon wafer

This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon, polycrystalline silicon grinding, and bevelling.

This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon,polycrystalline silicon grinding and bevelling.

Standard size：200*62*80*5*7 and 200*62*80*15*10

Grit：100#—1000#

Following is the specification of this type of grinding wheels:

Silicon wafer grinding wheel size chart
Diameter	Thickness	Hole	Rim Width	Rim Thickness
200	35	76	3,5,6,9	3~8
200	50	80	3,5,6,9	3~8
200	60	80	3,5,6,9	3~8
220	65	180	3,5,6,9	3~8
300~350	20~40	127	5,7	3~8

MAECENAS IACULIS

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ADIPISCING CONVALLIS BULUM

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